ITEC wants to ensure a seamless transfer of their Tagliner production from their current supplier to Sioux Assembly to maintain market supply.
Sioux successfully developed several critical Tagliner modules (WaferChange, High Density Optics, Product Handler RFID). Sioux Assembly transitioned the production of these modules to its own supply chain. The NPI team from Assembly industrialized the process, focusing on knowledge transfer and integration of 5 systems, using Azumuta for instructions.
Sioux succeeded to build and test the first Tagliner in five months and additional modules are reallocated to the new supply chain, with 15 units completed by the end of 2024 and 10 more orders in progress.
The good cooperation between ITEC and Sioux in the Tagliner project resulted in a follow up: the transfer of the DBSG (Diebonder) including all the modules assembled and tested by Sioux.
ITEC provides the highest productivity assembly, test, inspection and smart manufacturing platforms, targeting mass volume manufacturing from semiconductor to RFID and LED devices. ITEC is headquartered with a R&D team in Nijmegen, Netherlands, and has a large supply chain and customer support office in Hongkong.